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An Electronics Manufacturing Minor in Engineering with Emphasis on Rapid Prototyping Paul T. Hulina, David L. Landis The Pennsylvania State University Center for Design and Computing, 11 EE West University Park, PA 16802-2702 e-mail: [email protected] Abstract The first is an electroni8c system design and prototyping course, and the second is a capstone design class which offers combined clesign and manufacturing project experience. The intent of our pilot project was to validate the interdisciplinary aspects of our approach, and provide preliminary results which would be used to support a larger scale NSF curriculum development proposal effort. ISpelcifically, we proposed a new course in Rapid System Protopping (EE497K) which would provide the system design component needed for this electronic manufacturing program. A second goal was to run a small pilot program for the capstone design course by creating project teams from a select group of students who are each riegistered in one of the three courses. These project teams would use the design and manufacturing engineering expertise developed in their respective clas,sesto carry electronic manufacturing problems from concept through completion.
This paper describes an Electronics Manufacturing curriculum development project at Penn State. This pilot project is intended to enhance the design and practical experiences of undergraduate engineering students by combining the resources of the Electrical Engineering Department, the Industrial and Manufircturing Engineering Department, and the Center fbr Electronic Design, Communications, and Computing (CEDCC). The EE Department curriculum and laboratories support electronic circuit design and microelectronic processing? while the IE Department has significant expertise und laboratory fhcilities in printed circuit board assemh!v with (I strong emphasis on surj;;lce mount technology processes. The Center for Electronic Design, Communications, and Computing (CEDCC) has in place a supporting infrastructure for rapid electronic system design and prototyping which complements both the EE and IE department programs.
Background Project Scope
Our long term goal is to combine faculty expertise and laboratory resources in order to enrich the education of undergraduate students by establishing a College of Engineering Minor in Electronic Manufacturing. This program will offer the techniques and results of ongoing faculty and graduate student research activities to undergraduate students through a coherent and coordinated set of courses which provide breadth and depth in the important areas of electronic product design and manufacturing. The effort will be interdisciplinary and will draw on faculty expertise from various departments in the college including Computer Science and Engineering, Electrical Engineering, and Industrial and Manufacturing Engineering.
The three courses summarized in Table I form the backbone of our Electronic Manufacturing Minor program. These courses f0cu.s on three essential aspects of an electr80nic manufacturing minor; namely, electronic design and prototyping, packaging and assembly, and manufacturing technologies needed for volume production. Each course requires students to complete a semester design/analysis project either individually or in a group. The first goal of our pilot project was to develop and teach the rapid system prototyping class. A second goal was to create interdisciplinary project teams from among the students registered for the three courses. Team members would be assigned responsibilities according to their respective class; for example, the “Rapid System Prototyping” class student could be responsible for exploring design alternatives, the “Advanced Circuit Board Design” student responsible for evaluating packaging and assembly tradeoffs, and the “Electronic Assembly” student responsible for evaluating manufacturing methlods8and techniques.
Undergraduate courses in Electronic Assembly (IE497A) and Advances in Circuit Board Design (EE497K) which have been previously developed and taught provide a partial base for the new Electronic Manufacturing Minor program. At least two additional courses are needed to extend this base.
the-art. Our longer term proposal is to carefully craft a collaborative electronics manufacturing educational environment between regional universities. Such a program will allow us to meet the objectives of an effective and cost efficient practice-based high technology manufacturing education. Furthermore, this can be done in a way that benefits the participating schools and their undergraduate students by allowing them to share the resource burden of both course and laboratory development and maintenance. This provides a cost effective way to meet industry requirements for curricula that are geared to the new era of concurrent engineering for electronic manufacturing.
Several common shortcomings of an undergraduate engineering degree program are addressed in our curriculum development project. Seniors frequently complain that they have a very poor sense of the actual day-to-day work of engineering; the predominance of analysis problems and canned laboratory experiments with a well-defined outcome are far from the normal activities of a practicing engineer. Our goal is to offer students a taste of real-world electronics manufacturing engineering by providing incompletely specified problems without a known outcomes, and requiring the students to create a solution and carry it through to the physical prototype stage. In addition to developing problem solving skills, our proposed program will address the criticism that engineering graduates do not have adequate teamwork skills, or experience as a participant in a team project. Equally important, we address the concern that our students tend to focus on small analytical problems and not on larger scale interdisciplinary engineering optimization problems.
Accomplishments The majority of the objectives of our initial pilot project were accomplished. A Rapid System Prototyping course was successfully developed which provides senior and entry graduate students experience in the techniques and methodologies of rapid prototyping of electronic systems This course was facilitated by extensive use of WWW resources. All course materials, tutorials, homework assignments, and reference materials were provided on the CEDCC WWW server; refer to http://www,cedcc.psu.edu/ee497f/. In addition, CEDCC developed on-line help and CAD tool resource guides; refer to http://www cedcc.psu.edu/cadtools/index. html. Due to scheduling conflicts and resource limitations, we were not able to complete the capstone design course project team experiment. However, students in the individual courses were challenged with design skills and projects requiring cross-disciplinary technologies.
Our proposed program focuses on an Electronic undergraduate minor, but our Manufacturing methodology addresses the universal academic problem of diminishing resources and associated budget cuts which are most damaging to high overhead practicebased undergraduate degree programs. Engineering departments cannot provide students with access to specialized equipment from the many disciplines used in world class electronic manufacturing operations. Instead, limited resources must be marshaled to meet the undergraduate breadth requirement by supporting general purpose laboratory experiences. Consequently, undergraduate engineering programs frequently lack depth because they use equipment and practices which significantly lag behind the current industrial state-of-
CEDCC Workstation Lab; Cadence Prog. IC Tools with VHDL synthesis
Manufacturing processes for Printed Circuit Board design. PCBs with both thru hole and layout, analysis, and assembly; packaging surface mount components. interconnect and Material to include processes. options, CAD tools; modeling req’d tooling, & underlying and prediction of reliability, scientific principles. failure modes, accelerated testing.
Methodologies & techniques for prototyping; system electronic design synthesis; system alternatives, cost & design time tradeoffs, design for testability, design for reliability, design for manufacturability, etc.
utilizing CAD laboratory schematic capture, placement, and wiring tools to create and evaluate PCB layout